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Beryllium Copper Alloy 25

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OVERVIEW of Beryllium Copper Alloy 25

Beryllium Copper 25 is a Copper base alloy with the capability of being strengthened by precipitation heat treatment. The alloy furnishes the best combination of electrical conductivity, corrosion resistance and mechanical strength necessary for numerous electronic and electro-mechanical devices.

Beryllium Copper 25 alloy is quite satisfactory for fabrication with good formability and joining characteristics. Forming is readily accomplished from the annealed temper. Severe bending will be less successful from hard or heat treated tempers and requires large fold radius ratios.

Beryllium Copper 25 is able to be soldered, brazed, and welded by most standard techniques. The brazing temperature must be kept under 1450° F and cycle time minimized to avoid loss of heat treated strength. Heat treating should be performed subsequent to welding to obtain uniform high strength. The alloy is not susceptible to an increase in magnetic attraction from plastic deformation during service such as occurs with the ferromagnetic stainless steels.

FEATURES AND BENEFITS of Beryllium Copper Alloy 25

  • Beryllium Copper 25 conforms to ASTM B194 and UNS C17200.
  • Beryllium Copper Alloy 25

    Links:
  • Berilium 25 Datasheet

  • Conforms to ASTM B194
  • Confirms to UNS C17200.
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