OVERVIEW of Pyralux® APR Copper-clad Resistor Laminate |
DuPont™ Pyralux® APR copper clad resistor laminate is ideal for advanced applications in military, aerospace, automotive and consumer electronics markets, where reliable embedded resistor technology, temperature tolerance, and robust processing is required.
This patented all polyimide composite is a double sided construction of polyimide film bonded to copper foil, and features Ticer Technologies' TCR® thin film copper resistor foil as one or both of the clad foils.
DuPont™ Pyralux® APR copper clad resistor laminate is available in a broad range of dielectric thicknesses and resistance levels, to provide designers, fabricators, and assemblers a wide variety of circuit constructions.
Standard Sheet Sizes: 12" x 18", 12" x 24", 18" x 24" & 24" x 36"
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FEATURES AND BENEFITS of Pyralux® APR Copper-clad Resistor Laminate |
Features of Pyralux® APR Copper-clad Resistor Laminate
Excellent resistive layer tolerance and electrical performance
Excellent dielectric thickness tolerance
Embedded capacitance and resistance in a single laminate
Thin, rugged copper clad laminate with superior handling and processing
High copper polyimide resistor foil adhesion strength
Low coefficient of thermal expansion for flex and rigid multi-layer PCBs
Excellent thermal resistance, up to 180C (356F) M.O.T.
UL 94V-0, UL Registered, File E124294
Compatible with printed wiring board industry processes, IPC 4204/11 certified
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